Spartan Daily, December 13, 1939

Volume 28, Issue 57https://scholarworks.sjsu.edu/spartandaily/3003/thumbnail.jp

Multi-Material Ultrasonic Consolidation

Ultrasonic consolidation (UC) is a recently developed direct metal solid freeform fabrication process. While the process has been well-demonstrated for part fabrication in Al alloy 3003 H18, including with intricate cooling channels, some of the potential strengths of the process have not been fully exploited. One of them is its flexibility with build materials and the other is its suitability for fabrication of multi-material and functionally graded material parts with enhanced functional or mechanical properties. Capitalizing on these capabilities is critical for broadening the application range and commercial utilization of the process. In the current work, UC was used to investigate ultrasonic bonding of a broad range of engineering materials, which included stainless steels, Ni-base alloys, brass, Al alloys, and Al alloy composites. UC multimaterial part fabrication was examined using Al alloy 3003 as the bulk part material and the above mentioned materials as performance enhancement materials. Studies were focused on microstructural aspects to evaluate interface characteristics between dissimilar material layers. The results showed that most of these materials can be successfully bonded to Al alloy 3003 and vice versa using the ultrasonic consolidation process. Bond formation and interface characteristics between various material combinations are discussed based on oxide layer characteristics, material properties, and others.Mechanical Engineerin

Educating English Language Learners in Dexter

This case was commissioned by Public Education Network (PEN) and prepared by the Rennie Center for Education Research and Policy. This case was designed for use at PEN's 2006 annual conference, and focuses on meeting the educational needs of English Language Learners (ELLs) in a fictitious community

Remarks on the Spectral Properties of Tight Binding and Kronig-Penney Models with Substitution Sequences

We comment on some recent investigations on the electronic properties of models associated to the Thue-Morse chain and point out that their conclusions are in contradiction with rigorously proven theorems and indicate some of the sources of these misinterpretations. We briefly review and explain the current status of mathematical results in this field and discuss some conjectures and open problems.Comment: 15,CPT-94/P.3003,tex,

The Trail, 2013-12-13

https://soundideas.pugetsound.edu/thetrail_all/3003/thumbnail.jp

Alien Registration- Madden, P. W. (Old Orchard Beach, York County)

https://digitalmaine.com/alien_docs/3003/thumbnail.jp

The Evening Herald (Albuquerque, N.M.), 07-15-1920

https://digitalrepository.unm.edu/abq_eh_news/3003/thumbnail.jp

Tucker v. State Appellant\u27s Brief Dckt. 42448

https://digitalcommons.law.uidaho.edu/not_reported/3003/thumbnail.jp

On the Origin of Charging Damage during Etching of Antenna Structures

Monte Carlo simulations of charging and profile evolution in patterned antenna structures during etching in high-density plasmas reveal a rapid change in the potential of the lines at end point, which causes a surge in electron tunneling through thin gate oxides and possibly charging damage. The condition of the substrate (grounded vs. floating) determines the magnitude of the surge and whether it will be followed by a steady-state current until all lines of the pattern become disconnected. A reduction in damage is possible by controlling the substrate condition, which may be assessed through notching experiments