Reflow Process Parameters Analysis and Reliability Prediction Considering Multiple Characteristic Values

Abstract

As a major step surface mount technology, reflow process is the key factor affecting the quality of the final product. The setting parameters and characteristic value of temperature curve shows a nonlinear relationship. So parameter impacts on characteristic values are analyzed and the parameters adjustment process based on orthogonal experiment is proposed in the paper. First, setting parameters are determined and the orthogonal test is designed according to production conditions. Then each characteristic value for temperature profile is calculated. Further, multi-index orthogonal experiment is analyzed for acquiring the setting parameters which impacts the PCBA product quality greater. Finally, reliability prediction is carried out considering the main influencing parameters for providing a theoretical basis of parameters adjustment and product quality evaluation in engineering process