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Optimalization of repair process in Surface Mount Technology

By Radek Vala

Abstract

This project deals with utilizing of IR 400 equipment for assembly and repair of SMD components soldered by lead-free solder materials. The part of the work concerns with optimizing of the temperature profile, which is very important in the repair to eliminate the damage of components and PCB. There was added controller R 500 and cooling equipment to allow better control of the temperature during the soldering cycle

Topics: lead-free solder; montáž a opravy součástek; pájecí profil; bezolovnaté pájky; Infrared reflow soldering; Infračervené pájení přetavením; solder profile; assembly and repair of components
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Year: 2011
OAI identifier: oai:invenio.nusl.cz:239583
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