oaioai:invenio.nusl.cz:219522

Monitoring of Solder Spreading Velocity on Metal Surface

Authors
Publication date
1 January 2012
Publisher
Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií

Abstract

This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment

Similar works

Full text

thumbnail-image

National Repository of Grey Literature

redirect
oaioai:invenio.nusl.cz:219522
Last time updated on 10/08/2016

This paper was published in National Repository of Grey Literature.

Having an issue?

Is data on this page outdated, violates copyrights or anything else? Report the problem now and we will take corresponding actions after reviewing your request.