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Monitoring of Solder Spreading Velocity on Metal Surface

By Miroslav Růžička

Abstract

This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment

Topics: videosekvence; surface finish; rychlost roztékání pájky; velocity of spreading solder; videosequence; length of spreading solder; délka roztečení pájky; Wetting surface; Smáčení povrchu; smáčecí úhel; wetting angle; povrchová úprava
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Year: 2012
OAI identifier: oai:invenio.nusl.cz:219522
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