Treballs Finals de Grau d'Enginyeria Química, Facultat de Química, Universitat de Barcelona, Curs: 2014-2015, Tutors: Jordi Bonet i Ruiz i Olga Perarnau i MeliàThis project has been carried out at DENSO Barcelona and it is focused on the study of electronic components decapsulation by means of automatic disassembling system using chemical products. DENSO is a leading supplier of advanced automotive technology, systems and components for major automakers. All electronic components are encapsulated in mold to protect internal structure of external damages compound. The automatic decapsulation system takes an integrated circuit encapsulated in mold compound and removes it using a user-specified chemical solution. The main objective of this processing at automotive industry consists in detect and seen semiconductor failure analysis. In the automatic decap user can modify the etch parameters (etching temperature, etching time, acid mixture…) depending sample measures and material composition. The target of this project is to make experimental tests with different electronic components to create an optimal decapsulation handbook, for in the future only seeing the component user will be able to select the correct etching program, and study the effect of acids over bonding wires(connections between chip surfaces and terminals in a component) when the material used as copper. During the study engineer will understand semiconductors materials fabrication, internal packaging structure, chemicals usage for decapsulation and rinse, safety operations in the laboratory and analysis techniques. Trial and error method will be used to establish the best etching conditions. A total of 10 decapsulation programs are created for different electronic components (integrated circuits and transistors) during this project. For the study of acids effects in copper material, the automatic decapsulation machine presents, Bias Voltage (method create to protect copper). Different voltages will be tested in this project in order to establish a good value for in the future protect the copper wires. Satisfactory results are obtained and an optimal voltage can be established
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