The use of cardanol containing epoxy binder for making of PCB
Abstract
The article touches upon the possibility of phenalkamine binder system on the base of cardanol and bisphenol aepoxy resin us age for PCB with low formaldehyde emission makinИзучена возможность изготовления ДСтП с использованием связующей системы феналкамина на основе карданола и эпоксиднодиановой смолы с целью получения ДСтП с низкой эмиссией формальдегидSimilar works
Full text
Last time updated on 13/07/2016
This paper was published in Electronic archive of the Ural State Forest Engineering University.
Having an issue?
Is data on this page outdated, violates copyrights or anything else? Report the problem now and we will take corresponding actions after reviewing your request.