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Modeling and Simulation for Physical Vapor Deposition

By Jürgen Geiser and Robert Röhle

Abstract

In this paper, we present modeling and simulation for physical vapor deposition for metallic bipolar plates. In the models, we discuss the application of different models to simulate the transport of chemical reactions of the gas species in the gas-chamber. The so called sputter process is an extremely sensitive process to deposit thin layers to metallic plates. We taken into account lower order models to obtain first results with respect to the gas fluxes and the kinetics in the chamber. The model equations can be treated analytically in some circumstances and complicate multi-dimensional models are solved numerically with a software-packages (UG unstructed grids). Because of multi-scaling and multi-physical behavior of the models, we discuss adapted schemes to solve more accurate in the different domains and scales. The results are discussed with physical experiments to give a valid model for the assumed growth of thin layers

Topics: Physical vapor deposition, multi-scale problem convection-diffusion equations, reaction equations, splitting methods, 510 Mathematik, ddc:510
Publisher: Humboldt-Universität zu Berlin, Mathematisch-Naturwissenschaftliche Fakultät II, Institut für Mathematik
Year: 2011
OAI identifier: oai:edoc.hu-berlin.de:18452/3443
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