The diffusion and activation of n-type impurities (P and As) implanted into
p-type Ge(100) substrates were examined under various dose and annealing
conditions. The secondary ion mass spectrometry profiles of chemical
concentrations indicated the existence of a sufficiently high number of
impurities with increasing implanted doses. However, spreading resistance probe
profiles of electrical concentrations showed electrical concentration
saturation in spite of increasing doses and indicated poor activation of As
relative to P in Ge. The relationships between the chemical and electrical
concentrations of P in Ge and Si were calculated, taking into account the
effect of incomplete ionization. The results indicated that the activation of P
was almost the same in Ge and Si. The activation ratios obtained experimentally
were similar to the calculated values, implying insufficient degeneration of
Ge. The profiles of P in Ge substrates with and without damage generated by Ge
ion implantation were compared, and it was clarified that the damage that may
compensate the activated n-type dopants has no relationship with the
activation of P in Ge.Comment: 6 pages, 4 figure