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Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
Authors
Bernhard Wunderle
Brian Burg
+8 more
Florian Schindler-Saefkow
Gerd Schlottig
Jonas Zürcher
Luca Del Carro
Rahel Stässle
Severin Zimmermann
Thomas Brunschwiler
Uwe Zschenderlein
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'ASME International'
Doi
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info:doi/10.1115%2F1.4034927
Last time updated on 04/11/2020