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Deconvolution and elastography based on dimensional ultrasound
Authors
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,
+9 more
,
,
A Gee
H Gomersall
N Kingsbury
J Lindop
R Prager
HC Shin
G Treece
Publication date
1 December 2008
Publisher
Abstract
This paper is in two parts and addresses two of getting more information out of the RF signal from three-dimensional (3D) mechanically-swept medical ultrasound . The first topic is the use of non-blind deconvolution improve the clarity of the data, particularly in the direction to the individual B-scans. The second topic is imaging. We present a robust and efficient approach to estimation and display of axial strain information. deconvolution, we calculate an estimate of the point-spread at each depth in the image using Field II. This is used as of an Expectation Maximisation (EM) framework in which ultrasound scatterer field is modelled as the product of (a) a smooth function and (b) a fine-grain varying function. the E step, a Wiener filter is used to estimate the scatterer based on an assumed piecewise smooth component. In the M , wavelet de-noising is used to estimate the piecewise smooth from the scatterer field. strain imaging, we use a quasi-static approach with efficient based algorithms. Our contributions lie in robust and 3D displacement tracking, point-wise quality-weighted , and a stable display that shows not only strain but an indication of the quality of the data at each point in the . This enables clinicians to see where the strain estimate is and where it is mostly noise. deconvolution, we present in-vivo images and simulations quantitative performance measures. With the blurred 3D taken as OdB, we get an improvement in signal to noise ratio 4.6dB with a Wiener filter alone, 4.36dB with the ForWaRD and S.18dB with our EM algorithm. For strain imaging show images based on 2D and 3D data and describe how full D analysis can be performed in about 20 seconds on a typical . We will also present initial results of our clinical study to explore the applications of our system in our local hospital. © 2008 IEEE
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Last time updated on 15/07/2020