Noda, Ryuzo

Okoda, Seiichi

Omura, Ichiro

Tashiro, Katsuji

Tsukuda, Masanori

High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules. The equipment has been planning to have automatic GO/NO GO judgment technology by high-throughput measurement of current signal distribution with non-contact sensor arrays with small coils over the bonding wires of IGBT chips. Basic technology and Prototypes of a sensor, an analog amplifier, digital compensation technology, a test head and power circuit have been almost completed. The authors will fabricate the sensor arrays and develop GO/NO GO judgement technology with the integration of a basic technology.8th International Conference on Integrated Power Electronics Systems (CIPS 2014), February  25-27, 2014, Nuremberg, German

High-throughput DBC-assembled IGBT screening for power module

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