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Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint Integrity
Authors
Emeka H Amalu
R. S. Bhatti
N. N. Ekere
G. Takyi
Publication date
1 January 2010
Publisher
Abstract
Abstract is not available.
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Teeside University's Research Repository
See this paper in CORE
Go to the repository landing page
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oai:https://research.tees.ac.u...
Last time updated on 04/05/2020
Teeside University's Research Repository
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:https://research.tees.ac.u...
Last time updated on 04/05/2020
