Le, HR

Lionis, N

Mackay, RE

Microsystem Technologies

English

This paper examines wet and dry fabrication of vertical micro-mirrors in (110) silicon for use in an innovative BioMEMS integrating gripping and micro force sensing functionalities. Wet anisotropic chemical etching in potassium hydroxide (KOH) and tetramethyl ammonium hydroxide (TMAH) with and without isopropanol alcohol (IPA) additive was examined. Deep Reactive Ion Etched samples were produced using inductive coupled process. 3D surface roughness of samples was examined using scanning electron microscope, interferometric profilometer and atomic force microscopy. An optic fiber displacement sensor was exploited to measure the reflectivity of uncoated or coated samples with evaporated metallic thin film. The research aimed to find optimal fabrication technique for fabricating vertical micro-mirrors in polymer based BioMEMS. TMAH etched silicon samples with surface roughness R a = 15.1 nm showed highest reflectivity of all structures fabricated, reflectivity was more than doubled by adding a 10 nm layer of evaporated aluminum coating

Plymouth Electronic Archive and Research Library

A BioMEMS review: MEMS technology for physiolog-

A Raman study of etching

Actuators A

Actuators A 128(2):387–394 Microsyst Technol Journal : Large 542 Dispatch :

agitation and surfactant additive on silicon anisotropic etching in

Anisotropic

Anisotropic etching of silicon with KOH–H2O–

Anisotropic etching rates of single-crystal silicon for

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doped TMAH for bulk micromachining of silicon.

Etch rates for micromachining

etching of crystalline silicon in alkaline solutions.

fabrication of SU-8 based electro-thermal micro-grippers.

Fabrication of vertical mirrors using plasma etch

for ﬁber-optic switching applications.

holding time using squeeze ﬁlm effect for side airbag systems.

ically integrated devices.

In: Huff HR, Burgess RR

n-Si\111 [and n-Si\100 [wafers in the visible region at

prospects.

Roughening of single-crystal silicon surface etched by KOH

Sens Actuators A 73(1–2):122–130

silicon in aqueous KOH.

solution.

Temperature inﬂuence on etching deep holes with SF6/O2

TMAH water solution as a function of crystallographic orien-

using DRIE and KOH crystalline etching

Vertical Etching of silicon at very high aspect

Vertical mirrors fabricated by deep reactive ion etching

3D surface topography and reflectivity of anisotropic etched silicon micromirrors for BioMEMS

3D surface topography and reflectivity of anisotropic etched silicon micromirrors for BioMEMS

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