提出了一种酸性锡铋合金电沉积工艺。研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。另外 ,通过循环伏安曲线的测量研究了锡铋合金的电沉积过程 ,结果表明 ,镀层铋含量随硫酸铋含量的增大而增大 ,铋在 - 0 3V时开始析出 ,当电位达到 - 0 6V时 ,锡和铋共同沉积。A process for acid lead free tin-bismuth alloy electrodeposition was advanced. The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied. In addition, electrochemical behavior of tin-bismuth alloy deposition was studied by cyclic voltammetry. The results show that bismuth content in the obtained alloy deposit increases with the increase of bismuth sulfate in plating bath, bismuth starts to deposit at -03 volt, and codeposits with tin when potential moves negatively to -06 volt.福建省自然科学基金资助项目 (E 0 0 5 0 0 0 4
