In this study, the impact of the stress in SiNx surface passivation layers on off-state drain and gate leakage currents and off-state breakdown voltage in AlGaN/GaN High Electron Mobility Transistors (HEMTs) is assessed. The SiNx films were deposited at room temperature by inductively coupled plasma chemical vapour deposition (ICP-CVD). Compared to unpassivated devices, the off-state drain and gate leakage currents of AlGaN/GaN HEMTs is increased by up to 2 orders of magnitude for a 200 nm thick SiNx passivation layer with 309 MPa compressive stress. The use of a bilayer SiNx passivation scheme comprising 70 nm SiNx with 309 MPa compressive stress followed by 130 nm SiNx with 880 MPa compressive stress resulted in off-state drain and gate leakage currents reduced by up to 1 order of magnitude when compared to unpassivated devices
