This paper was presented at the 4th Micro and Nano Flows Conference (MNF2014), which was held at University College, London, UK. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute, ASME Press, LCN London Centre for Nanotechnology, UCL University College London, UCL Engineering, the International NanoScience Community, www.nanopaprika.eu.The manifold microchannel (MMC) heat sink is an effective method of electronic device cooling featured by the advantages such as low thermal resistance, compact structure, low flow rate and uniform temperature distribution along the flow direction. To improve the performance of MMC, numerical studies on geometry features of pin fin microchannel were carried out and the characteristics of flowing and heat transfer in two types of MMC structures which are respectively optimized through porosity with different pin-fin distribution and pin-fin located angle were investigated. Numerical results indicated that there are apparent influences of both above geometry features on the characteristics of flowing and heat transfer in MMC. Based on cooling
performance factor, an optimum value of porosity with specific pin-fin distribution was obtained. Moreover, better effect on heat transfer could be achieved at a 30 degree around of rectangular pin fin located angle in our work
