Preface to the Special Issue on “2nd International Congress on Advances in the Packaging Industry - Product and Process (API 2017)”

Abstract

The “2nd International Congress on Advances in the Packaging Industry - Product and Process (API 2017)” was held in Milan (Italy) on 26-27 November 2017. The congress was organized by the Regional Competence Centre for Technologies (CRdC Tecnologie Scarl, www.crdctecnologie.it), and the Italian Flexible Packaging Association (Giflex, www.giflex.it). The aim of the organizers was at creating a multidisciplinary forum to discuss priority themes worth of further investigation in the fast-growing field of flexible packaging, taking into account the perspectives of the scientific as well as the productive world. This special issue of the “Journal of Applied Packaging Research” is dedicated to API 2017. It collects a well-balanced selection of academic and industrial papers presented during the congress

    Similar works