Thermally actuated micromirrors were fabricated to demonstrate a CMOS compatible surface micromachined MEMs process that was developed. A key step in the process was the used of a XeF2 etch to release the structures. A design was created that varied key factors including mirror pad size and number of anchors. For the smallest pads attached by a single anchor, the length and width was varied. The release etch was found to require a sacrificial layer of greater than one micron for fest lateral undercutting. Mirrors with the longest and narrowest necks were found to display the greatest deflection
