As next-generation electronic products emerge, there is a need to create more electronic functionality in compact spaces. One of the techniques to achieve this is by integrating electronic circuitry on mechanical stress bearing parts of electro-mechanical products. Direct-write printing processes like inkjet printing and aerosol jet printing can be used to print conductive inks on conformal surfaces of mechanical components. Advanced curing/sintering processes such as pulsed photonic curing can be used to cure/sinter printed inks to produce conductive traces. However, the use of photonic curing on conformal surfaces introduces two sources of variability into the process, which are the distance and slope between the flash lamps and the conformal substrate. This research studies the effects that distance and slope between the flash lamps and substrate have on the characteristics of the photonically cured material. Screen printed samples of copper nanoparticle ink on paper substrates were photonically cured at various distances and slope settings in a Novacentrix Pusleforge 3300 machine. Analysis of the experimental data reveals that there is significant decrease in the conductivity of the cured copper ink with increase in both the distance and slope between the flash lamps and the substrate. The lowering of conductivity of the coupons with increase in distance was correlated to the reduction in the intensity of pulsed light with distance from the source. Similarly, the lowering of conductivity of the coupons with increase in slope was correlated to the reduction in the intensity of pulsed light with increase in angle between the incident light and the surface normal. A spectrophotometer was used to correlate the lowering of the conductivity of the printed coupon to the reduction in the amount of light absorbed by the coupon surface with increase in the slope from the flash lamps. This research highlights that distance and slope variations are important considerations to achieve uniform electrical properties in conformal printed electronics undergoing photonic curing
