Structure and electric resistance of Sn-Cu(Ag) solders in the precrystallization temperature range

Abstract

This work was partially supported by the State Foundation for Fundamental Research (Project No. F-28.3/024).We investigate the atomic structure of tin-based solders by X-ray diffraction methods and the reverse Monte Carlo method. Total and partial structural factors and pair correlation functions are calculated. It is shown that Sn0.987Cu0.013, Sn0.962Ag0.038, and Sn0.949Ag0.038Cu0.013 liquid alloys are characterized by a microinhomogeneous structure with Cu(Ag)-Sn clusters distributed in the tin-based matrix