Carll, C.G.

DeGroot, R.C.

Gertjejansen, R.O.

Hall, H.J.

Schmidt, E.L.

Eighteen liquid or powdered phenolic resole resin-bonded types of aspen (Populus tremuloides) waferboard were manufactured incorporating eight commercially manufactured and one experimental preservative. Preservatives were applied by pretreating wafers, incorporating them with wax or resin at the time of furnish preparation or by dipping or pressure treating finished panels. Testing was conducted before and after accelerated aging, as outlined by the American Society for Testing and Materials Standard Method D 1037. The minimum property requirements of 450,000 psi (3103 MPa) for modulus of elasticity and 2,500 (17.2 MPa) for modulus of rupture of the American National Standard (ANSI A208.1 - 1979) for mat-formed grade 2-MW wood particleboard were attained by all panel-types. However, the 50 psi (345 kPa) internal bond specification was not attained in the panel type containing wafers pretreated with formaldehyde and sulfur dioxide or the panel type pressure treated with ammoniacal copper arsenate. Also, the formaldehyde and sulfur dioxide treated panel type did not retain a modulus of rupture of at least 1,250 psi (8.6 MPa) after accelerated aging as required by the American National Standard. All panel types but the formaldehyde and sulfur dioxide treated and those treated with a chromated copper arsenate wax emulsion prior to the addition of resin retained at least 50 percent of their control modulus of rupture after accelerated aging

Preservative treatment effects on mechanical and thickness swelling properties of aspen waferboard

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