AY Kim

B Ha

B Sciacca

CH Chung

D Langley

D Sui

EC Garnett

H Lee

HH Khaligh

HS Kim

J Jang

J Kang

J Lee

JJ Bae

JP Li

JY Lee

K Song

LT Dou

M Tsuji

P Cheng

P Lee

PF Kou

QJ Huang

RM Mutiso

S Hong

SJ Hong

SL Ji

T Kim

T Tokuno

W Gaynor

W Mehl

X He

X Wang

XG Yu

XL Tang

Y Kim

Y Zheng

YG Yao

YH Yoon

YS Rim

YS Yun

Scientific Reports

AbstractA facile method for producing high-performance nickel enhanced silver nanowire (Ag NW) transparent electrodes on a flexible substrate is reported. The modified electroplating method called enhanced nickel ion bridge joining of Ag NWs, which provides a new route for improving the loose junctions in bare Ag NW networks. The sheet resistance of Ag NW electrode drops from over 2000 Ω sq−1 to 9.4 Ω sq−1 with excellent thermal uniformity after the electroplating process within 10 s. Nickel enhanced Ag NW transparent films are applied on flexible heaters with good thermal stability (165 °C for 2 h) and mechanical flexibility (3500 cycles under 2.5 mm bending radius) after mechanical bending process. Moreover, the mechanism of nickel growth is also confirmed that the nickel electroplating of the Ag NWs obeyed Faraday’s Laws.</jats:p

Shang Wang

Yanhong Tian

Chunjin Hang

Chenxi Wang

Crossref

Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining

Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining

Abstract

Similar works

Full text

Available Versions

Crossref