Electron Microscopy Study of Hardboards

Abstract

Wet-formed and dry-formed aspen fiber hardboards are examined by transmission electron microscopy to obtain information on the hardboard internal structure and fiber-resin interactions. These factors, when related to strength and dimensional properties of hardboards, may be helpful in determining hardboard quality and suitability for structural use.During hardboard manufacturing, the wood cells break apart at the middle lamella and come in contact again when subjected to pressure during hot-pressing. Occasionally fibers remain attached in bundles. Various stages of middle lamella degradation can be observed. When totally disintegrated, middle lamella appears as dark granular material. Voids of variable size exist in medium- and high-density wet- and dry-formed hardboards. In wet-formed boards the resin (which has high electron opaqueness and appears black) shows even distribution. In dry-formed boards the resin shows uneven distribution; it is present as large accumulations in some areas but absent in others

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