In order to reduce cost and make up for the rising price of silicon, silicon wafers are sliced thinner and wider,eading to weaker wafers and increased breakage rates during fabrication process. In this work we have analysed different cracks origins and their effect on wafer’s mechanical strength. To enhance wafer’s strength some
etching methods have been tested. Also, we have analysed wafers from different points of an entire standard
production process. Mechanical strength of the wafers has been obtained via the four line bending test and detection
of cracks has been tested with Resonance Ultrasonic Vibration (RUV) system, developed by the University of South
Florida