Drewniak, James L.

Orlandi, Antonio

English

Missouri University of Science and Technology (Missouri S&T): Scholars' Mine

Missouri University of Science and Technology Scholars' Mine Electrical and Computer Engineering Faculty Research & Creative Works Electrical and Computer Engineering 01 Oct 2003 Electromagnetic Compatibility Issues in Mobile Computing Antonio Orlandi James L. Drewniak Missouri University of Science and Technology, drewniak@mst.edu Follow this and additional works at: https://scholarsmine.mst.edu/ele_comeng_facwork  Part of the Electrical and Computer Engineering Commons Recommended Citation A. Orlandi and J. L. Drewniak, "Electromagnetic Compatibility Issues in Mobile Computing," IEEE Transactions on Mobile Computing, vol. 2, no. 4, pp. 273-274, Institute of Electrical and Electronics Engineers (IEEE), Oct 2003. The definitive version is available at https://doi.org/10.1109/TMC.2003.1255642 This Editorial is brought to you for free and open access by Scholars' Mine. It has been accepted for inclusion in Electrical and Computer Engineering Faculty Research & Creative Works by an authorized administrator of Scholars' Mine. This work is protected by U. S. Copyright Law. Unauthorized use including reproduction for redistribution requires the permission of the copyright holder. For more information, please contact scholarsmine@mst.edu. Electromagnetic Compatibility Issuesin Mobile ComputingAntonio Orlandi and James L. DrewniakELECTROMAGNETIC compatibility (EMC) is the engineeringof electronic components and systems to ensure theoverall functioning in a complex electromagnetic environ-ment. Historically, this has included many aspects of thedesign, such as compliance with electromagnetic interfer-ence (EMI) regulatory standards, and insuring immunity ofelectronics to the electrical noise, i.e., interference generatedby a neighboring system or external source. Electrostaticdischarge (ESD) is one aspect of electronic immunity that canlead to failure at the IC, module, or system level that is againbecoming a major concern in electronic design. EMC hastraditionally also included wave-shaping and ensuringsignal fidelity, as well as design of an adequately low-noisepower distribution network to minimize EMI, and notcompromise signal fidelity. Historically, EMC has beencharacterized as a “copper-tape-and-ferrites,” trial-and-errordiscipline that reflects a postdesign approach to EMC. Asdesign cycles have decreased, this approach to EMC haschanged dramatically over the course of the past five to sevenyears. Within the commercial electronics community, theneed and demand for EMC computer-aided design toolsgrew as rapidly as the design cycles decreased, and thecomplexity and data rates of designs increased. However,suitable tools had not been developed and, inmany cases, theunderlying noise coupling and immunity physics were notwell understood. In large part, this state of affairs resultedfrom a lack of funding for more basic research and CAD tooldevelopment, and the complexity of the problem. Theimmediate demand for sophisticated EMC design tools thatwere undeveloped gave rise to focused research in EMC tounderstand the coupling physics and develop designmethodologies and tools in industry and academia alike.Many individual companies have made significant invest-ments in in-house EMC research, as well as funding ofuniversity research. The demand for a basic understandingof interference coupling physics, as well as design ap-proaches and tools led to the development of focused EMCresearch within the UMR EMCConsortium at the Universityof Missouri-Rolla, as well as a significant research emphasisin other electronics and packaging centers such as thePackaging Research Center at Georgia Tech and the CALCEElectronic Products and Research Center at the University ofMaryland.The field of EMC has grown into a number of specialtyareas, in particular, in the past five years, which reflects thepresent challenges associated with electronic design. Thishas resulted in part from increasing data rates and clockfrequencies, decreasing logic levels resulting from increasedpower requirements, decreasing design densities, mixed-signal analog/digital designs within the same package, andhigher frequency switching power supplies, among a hostof other issues. There is still a significant need for a basicunderstanding of EMC in many aspects of high-speeddigital and mixed-signal design including EMI (includingradio-frequency interference (RFI)), immunity (includingESD), signal integrity (SI), and power integrity, in parti-cular, at the IC, and IC substrate and packaging level. Inaddition, the need for modeling approaches and CAD toolsin all areas of electromagnetic compatibility is acute. In anengineering design environment, the models and tools mustbe suitable for rapid computation and be within theexpertise of a component or system designer to use. Inpractice, this reduces to circuit and transmission-linemodeling, i.e., the typical SPICE-type environment.The performance of first-pass engineering designvalidation hardware is often plagued by undesirableparasitics that compromise the signal fidelity and/orlevel, and dominate the coupling in the case of EMI andimmunity. The coupling is through the electric field(capacitive coupling), magnetic field (inductive coupling),or through a common current return path, intended orunintended. In short, EMC is “about the things that arenot on the circuit schematic,” i.e., parasitic effects. Thereis a critical need for design methodologies and CAD toolsthat are based on well-understood parasitic effects andcoupling physics, and can anticipate or extract suitableparasitic lumped circuit element models from a layoutgeometry. Presently, there are no such mature CAD tools.There are well-developed tools for the numerical solutionof Maxwell’s equations, RF circuit design tools, andcircuit simulation tools. However, tools for anticipatingparasitic effects are predominantly still at a beginningstage of development. To use a literature analogy, thecomplexity of the problem demands a solution with thesophistication of Tolstoy, but the available tools are at agrade-school primer stage of development.Among the most challenging of electronics designs forEMC are those associated with mobile computing. Thesedesigns are typically battery powered with no real-timegeneration, and are low-power. In addition, the designsIEEE TRANSACTIONS ON MOBILE COMPUTING, VOL. 2, NO. 4, OCTOBER-DECEMBER 2003 273. A. Orlandi is with the UAq EMC Laboratory, Department of ElectricalEngineering, University of L’Aquila, I-67040 Poggio di Roio, L’Aquila,Italy. E-mail: orlandi@ing.univaq.it.. J.L. Drewniak is with the Electromagnetic Compatibility Laboratory,Electrical and Computer Engineering Department, University of Missouri-Rolla, 1870 Miner Circle, Rolla, MO 65409. E-mail: drewniak@umr.edu.For information on obtaining reprints of this article, please send e-mail to:tmc@computer.org, and reference IEEECS Log Number 01-092003.1536-1233/03/$17.00  2003 IEEE Published by the IEEE CS, CASS, ComSoc, IES, & SPSoften have wireless sections for data transmission andreception and, of course, the digital computing section forinformation and data processing. The three distinct func-tions, i.e., power distribution and management, digitalcomputing, and RF wireless communication have verydifferent bandwidths, as well as voltage and current levels,yet in a typical mobile device, must share the same printedcircuit board and/or packaging substrate in a very densedesign. The resulting parasitics and interference posessignificant design challenges and requires considerabletrial-and-error to produce hardware that meets the designrequirements.Four papers are presented in this topical section on EMCthat are focused on modeling and circuit extraction ofnonideal effects and power integrity. The first two papersby G. Antonini, and G. Antonini and A. Ruehli presentvarying aspects of the partial element equivalent circuit(PEEC) method. This method is a first principles formula-tion, i.e., begins fromMaxwell’s equations and is based on anexact integral representation of the solution to the Helmholtzor wave equation. However, the result of the method is not anumerical solution of Maxwell’s equations, with currentdensities and electromagnetic fields, rather it is a circuit thatis suitable for SPICE-type simulation and is extracted forboth frequency- and time-domain analysis. Since the for-mulation is from first principles, all coupling and parasiticeffects are included to the extent that the relevant geometry ismodeled. In general, the extracted circuit can be quite largeand computation of the circuit elements time consuming,however, the simulation time can be reduced by combiningthe PEEC method with a fast-solver approach, the fastmultipole method (FMM) from traditional computationalelectromagnetics. The application of the FMM for PEECanalysis is presented, with applications.The second set of papers addresses aspects of powerintegrity. The first paper by J. Choi, S.-H. Min, J.-H. Kim,M. Swaminathan, W. Beyene, and X. Yuan presents anapproach for modeling and analysis of power distributionnetworks in high-speed digital designs. The power dis-tribution network in multigigabit designs are not typicallyelectrically small and, hence, require a Maxwell’s equationformulation to adequately capture effects that will have asignificant impact on the system response, in this casecurrent draw by a digital device, and the noise voltage onthe power distribution network. However, a Maxwellequation formulation to the problem is unsuitable forcircuit simulation and engineering design discovery. Choiet al. overcome this limitation by first using a fastsimulation approach for the power distribution network,which includes the electromagnetic effects and extracts amacromodel by representing the frequency response as arational function. The poles and residues are determined insuch a fashion that ensures stability and passivity repre-sentative of a linear, time-invariant system. The macro-model of the power distribution network is then combinedwith transmission-line and device models to anticipate thenoise on the power distribution network resulting fromdevice switching.The final paper by V. Ricchiuti addresses the impact onthe power distribution network using embedded capacitancefor the power/ground layers. This approach uses closelyspaced power/ground layers, on the order of one-quarter totwo mils, for the spacing to achieve a low-impedance powerbus structure that effectively mitigates noise propagation onthe parallel plate transmission-line geometry. The workpresents experimental results comparing the impedance andresulting measured electric fields for a test vehicle with twoplane sets of differing embedded capacitance.Antonio OrlandiJames L. DrewniakGuest EditorsAntonio Orlandi (M’90-SM’97) received theLaurea degree in electrical engineering fromthe University of Rome “La Sapienza,” Italy, in1988. He was with the Department of ElectricalEngineering, University of Rome “La Sapienza”from 1988 to 1990. Since 1990, he has beenwith the Department of Electrical Engineering atthe University of L’Aquila where he is currently afull professor. He is the author of more than100 technical papers he has published in thefield of electromagnetic compatibility in lightning protection systems andpower drive systems. His current research interests are in the field ofnumerical methods and modeling techniques to approach signal integrityand EMC/EMI issues in high-speed digital systems. Dr. Orlandi receivedthe IEEE Transactions on Electromagnetic Compatibility Best PaperAward in 1997 and the IEEE EMC Society Technical AchievementAward in 2003. He is member of the Education, TC-9 ComputationalElectromagnetics, and TC-10 Signal Integrity committees of the IEEEEMC Society, chairman of the “EMC Innovation” Technical Committee ofthe International Zurich Symposium and Technical Exhibition on EMC.From 1996 to 2000, he was an associate editor of the IEEE Transactionson Electromagnetic Compatibility and now serves as an associate editorof the IEEE Transactions on Mobile Computing.James L. Drewniak received the BS, MS, andPhD degrees in electrical engineering from theUniversity of Illinois at Urbana-Champaign in1985, 1987, and 1991, respectively. He joinedthe Electrical Engineering Department at theUniversity of Missouri-Rolla in 1991, where he isone of the principle faculty in the Electromag-netic Compatibility Laboratory. His research andteaching interests include electromagnetic com-patibility in high-speed digital and mixed signaldesigns, electronic packaging, and electromagnetic compatibility inpower electronic based systems. Dr. Drewniak is an associate editor ofthe IEEE Transactions on Electromagnetic Compatibility, and chair ofthe EMC Society technical committee TC-10 Signal Integrity.274 IEEE TRANSACTIONS ON MOBILE COMPUTING, VOL. 2, NO. 4, OCTOBER-DECEMBER 2003

Electromagnetic Compatibility Issues in Mobile Computing

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Electromagnetic Compatibility Issues in Mobile Computing

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