总结了近年来Sn-Zn基与不同成分基板的界面反应的研究现状,概括了界面反映的主要生成物是Cu6Sn5和Cu5(Zn,Sn)两种化合物.同时总结了提高Sn-Zn基无铅焊料润湿性能所作的工作,指出在添加剂中加入金属有机物可能会成为提高焊料润湿性能的一个途径.Interface reaction between Sn--Zn based lead--free solders and Cu substrate was Discussed, Cu6Sn5 and CuS（Zn, Sn）compound was revealed to formed in the Interface for most Sn--Zn based lead--free solders. Work on the improving the wettability of the Sn--Zn based lead--free solders was summary , and that flux adding metal--organic addition was addressed to be a way improving the wettability of the solder广西科学基金资助项目(0448022
