Holzwarth, Sybille

Litschke, Oliver

Serwa, Alexandra

Tran, Dinh Trung

Uhlig, Peter

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  PROCEEDINGS 11-15 September 2006      FACULTY OF ELECTRICAL ENGINEERING AND INFORMATION SCIENCE    INFORMATION TECHNOLOGY AND ELECTRICAL ENGINEERING - DEVICES AND SYSTEMS, MATERIALS AND TECHNOLOGIES FOR THE FUTURE      Startseite / Index: http://www.db-thueringen.de/servlets/DocumentServlet?id=12391 51. IWK Internationales Wissenschaftliches Kolloquium International Scientific Colloquium Impressum  Herausgeber: Der Rektor der Technischen Universität llmenau  Univ.-Prof. Dr. rer. nat. habil. Peter Scharff  Redaktion: Referat Marketing und Studentische Angelegenheiten  Andrea Schneider   Fakultät für Elektrotechnik und Informationstechnik  Susanne Jakob  Dipl.-Ing. Helge Drumm  Redaktionsschluss: 07. Juli 2006  Technische Realisierung (CD-Rom-Ausgabe):  Institut für Medientechnik an der TU Ilmenau  Dipl.-Ing. Christian Weigel  Dipl.-Ing. Marco Albrecht  Dipl.-Ing. Helge Drumm  Technische Realisierung (Online-Ausgabe):  Universitätsbibliothek Ilmenau    Postfach 10 05 65  98684 Ilmenau  Verlag:   Verlag ISLE, Betriebsstätte des ISLE e.V.  Werner-von-Siemens-Str. 16  98693 llrnenau   © Technische Universität llmenau (Thür.) 2006  Diese Publikationen und alle in ihr enthaltenen Beiträge und Abbildungen sind urheberrechtlich geschützt. Mit Ausnahme der gesetzlich zugelassenen Fälle ist eine Verwertung ohne Einwilligung der Redaktion strafbar.   ISBN (Druckausgabe): 3-938843-15-2 ISBN (CD-Rom-Ausgabe): 3-938843-16-0  Startseite / Index: http://www.db-thueringen.de/servlets/DocumentServlet?id=12391  51st Internationales Wissenschaftliches Kolloquium Technische Universität Ilmenau  September 11 – 15, 2006  Peter UHLIG, Sybille HOLZWARTH, Oliver LITSCHKE,  Alexandra SERWA; Dinh Trung TRAN   The Influence of Layer-to-Layer Misalignment on the Microwave Performance of LTCC Antenna Modules  4. Micro- and Nanoelectronics   Abstract: LTCC (Low Temperature Cofired Ceramics) dielectrics have a higher permittivity than most of the common organic circuit boards. Together with good RF-performance and nearly arbitrary layer count these are excellent prerequisites for high packaging density. The well-established screen-printing process used in LTCC is a further benefit in the volume production of this rugged design. However, there are some tradeoffs: Particularly in the frequency range considered here, miniaturization leads also to challenging demands in terms of manufacturing tolerances. It is quite obvious that apart from tolerances in material properties (permittivity and loss angle) deviations in the geometry will influence the overall system performance. In order to turn this often qualitatively heard discussion into quantifiable requirements, an 11-layer LTCC module was investigated thoroughly using a 3-D full wave EM simulation software. This paper will concentrate on the effect of layer-to-layer misalignment which is particularly interesting where vertical microwave transitions are necessary for vertical integration. The antenna module presented here represents a 4 x 4 element array building for digital beam forming at 30 GHz. The polarisation of the antenna patch elements is circular. Each element is fed by an individual hybrid coupler feed. The area for this circuitry is limited to the grid defined by the cell size of one element. In addition, the array requires a complex integrated calibration network. This high density microwave integration can be achieved by vertical integration in an LTCC-Multilayer.  Keywords: LTCC, Ka-Band, Planar Antenna, Satellite Communication, Manufacturing Tolerances  IMST GmbH, D-47475 Kamp-Lintfort, Germany, www.ltcc.de Phone: +49-2842-981 280 Fax: +49-2842-981 299 E-mail:Uhlig@imst.de 

The influence of layer-to-layer misalignment on the microwave performance of LTCC antenna modules

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The influence of layer-to-layer misalignment on the microwave performance of LTCC antenna modules

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