Embedding of communication device in a polymeric composite material

Abstract

In this paper, an attempt is amde to extend the deformation model of a communication device embedded in a viscoelastic thermoset composite polymer commonly known as sheet moulding compund (SMC). The original model takes into account time dependent heat transfer from the mould surface into the SMC charge and the consequent time dependant viscosity propagation during the initial stage of the mould closing and subsequent filling. The required model parameters for viscosity and elasticity have been determined from rheological testing