This project describes heat dissipation and mechanical deformation in BGAs. In contemporary industries, demand for smaller packages has increased the concern of thermal management. The lead-free movement has altered the properties of BGAs and comes with its own set of concerns. Packages were simulated and analyzed thermo-electrically using CAD and ANSYS software. The goal was to improve thermal management of electrical loads in CSP BGAs. Lead-based solder simulations demonstrated higher reliability than lead-free alternatives. Results indicate that maximum temperature and stresses were concentrated at the perimeter, especially the corners. This project resulted in suggestions for improvements for existing packaging and opportunities for future projects
