A new process is provided for the formation of self assembled polymer layers on a pretreated metallic substrate. The polymers used for forming such self assembled layers are homo, co and terpolymers of styrene and styrenic derivatives containing reactive groups selected from the group consisting of hydroxy, thiol, acetoxy, thioacetoxy, thiocyanate, thiolmethyl, thioacetoxymethyl, carboxy, and mixtures thereof. The pretreated metallic substrate having zerovalent metal or metal oxide surface is contacted with said polymeric solution or dispersion to form self assembled polymer layers on such a metallic substrate.U