In the present paper, the different techniques used for the determination of changes
of surface stress of solid electrodes, as well as the kind and quality of information that
can be achieved using these methods are discussed. The most important methods are
briefly reviewed and advantages/drawbacks highlighted. Special attention is paid to issues
related to the use of the “bending beam” (“bending cantilever”, “laser beam deflection”,
“wafer curvature”, etc.) methods. Recent development in these techniques has
been introduced and discussed
