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Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer
Authors
H.J.L. (author) Bressers
L.J. (author) Ernst
+3Â more
K.M.B. (author) Jansen
L.G. (author) Wang
G.Q. (author) Zhang
Publication date
1 January 2004
Publisher
'Institute of Electrical and Electronics Engineers (IEEE)'
Doi
Cite
Abstract
Mechanical, Maritime and Materials Engineerin
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TU Delft Repository
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Last time updated on 22/08/2013