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Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects
Authors
A Heryanto
A Musienko
+40 more
A Timma
AH Fischer
AP Karmarkar
B Kaouache
B Li
C Ryu
C-C Yang
CS Hau-Riege
CV Thompson
DS Gianola
E Zschech
EM Zielinski
ET Ogawa
H Ceric
J Gao Guo Jie
JA Nucci
JCM Li
JM Paik
JR Lloyd
JR Lloyd
JR Lloyd
K Piekoś
K Weide-zaage
K Zhang
KB Yeap
KJ Ganesh
L Zhang
MA Meyer
N Nabiollahi
O Brien BB
RE Rudd
SH Rhee
T Muppidi
V Sukharev
V Sukharev
Y Wu Zhen
YONG KIM JEE
Z Suo
ZS Choi
ZS Choi
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'Springer Science and Business Media LLC'
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info:doi/10.1186%2Fs40759-017-...
Last time updated on 01/04/2019