Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
- Authors
- Abdelkarim Mercha
- Alain Phommahaxay
- Ann Opdebeeck
- Antonio Pullini
- Bart De Wachter
- Bart Vandevelde
- Cristina Torregiani
- Dan Perry
- Dimitri Linten
- Dimitrios Velenis
- Eric Beyne
- Federico Angiolini
- Geert Van der Plas
- Guruprasad Katti
- Herman Oprins
- Igor Loi
- Ingrid De Wolf
- Jan Van Olmen
- Luca Benini
- Marc Nelis
- Michal Rakowski
- Michele Stucchi
- Miro Cupac
- Morin Dehan
- Muriel de Potter de ten Broeck
- Nikolaos Minas
- Paresh Limaye
- Paul Marchal
- Rahul Agarwal
- Riet Labie
- Stephane Bronckers
- Steven Thijs
- Veerle Simons
- Vladimir Cherman
- Wim Dehaene
- Wouter Ruythooren
- Youssef Travaly
- Publication date
- Publisher
- 'Institute of Electrical and Electronics Engineers (IEEE)'
- Doi
Abstract
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Last time updated on 01/04/2019