This paper evaluates the semiconductor on hexagonal-BN (h-BN) structure for power-supply on chip applications based on numerical simulations. Hexagonal-BN is used as an insulator of semiconductor -on-insulator (SOI) structure. Hexagonal-BN based SOI structure with through-silicon-via(TSV) shows higher heat dissipation performance without degrading electrical characteristics compared with the conventional SOI structure.2018 International Conference on Solid State Devices and Materials(SSDM2018), September9-13, 2018, Hongo Campus, The University of Tokyo, Tokyo, Japa
