The effect of depth of cut on multi-pass
nanometric machining of copper workpiece with diamond
tool was studied using the Molecular Dynamics (MD)
simulation. The copper-copper interactions were modelled
by the EAM potential and the copper-diamond interactions
were modelled by the Morse potential. The diamond tool
was modelled as a deformable body and the Tersoff
potential was applied for the carbon-carbon interactions. It
was observed that the average tangential and normal
components of the cutting forces increase with increase in
depth of cut and they reduced in consecutive cutting passes
for each depth of cut. Also, the ratio of the tangential to
normal force components decreases as the depth of cut
increases, but remains fairly constant after 1.5nm depth of
cut. The ratio of the cutting force to area decreases with
increase in the depth of cut and remains constant after
2.5nm depth of cut
