In this paper, preliminary data obtained using ceftriaxone (CEFTR) as additive in copper and nickel electrodeposition from acid baths are presented. Electrochemical behaviour of ceftriaxone and introductory information about the way its presence in the metalselectrodeposition bath influences the electrode processes have been obtained by cyclic voltammetry on platinum electrode. Inhibitory effect of ceftriaxone in the electrolyte solutions used in copper and nickel deposition processes was studied by linear voltammetry
