Effect of Thin-Film Adhesives on Mode I Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts

Abstract

A single sheet of NiTi shape memory alloy (SMA) was introduced within a unidirectional HexPly 8552/IM7 (Hexcel) polymer matrix composite (PMC) panel in conjunction with multiple thin-film adhesives to promote the interfacial bond strength between the SMA and PMC. A double cantilever beam (DCB) test was performed in accordance with the ASTM D5528 method for evaluation of Mode I interlaminar fracture toughness of unidirectional fiber-reinforced PMCs. The modal acoustic emissions (MAEs) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels were subjected to a C-scan before testing and examined using optical and scanning electron microscopy (SEM) techniques after part failure. The data were used in conjunction with modified beam theory (MBT), the compliance calibration (CC) method, and the modified compliance calibration (MCC) method. The Mode I interlaminar toughness (G(sub IC)) values for control specimens were higher than previously reported and are attributed to extensive fiber bridging during testing. The presence of adhesives with SMA inserts stabilized crack propagation during DCB testing. The results reveal a new phenomenon of SMA bridging, whereby crack propagation would switch from one side of the SMA insert to the other, thus increasing the load and G(sub IC) values of specimens containing SMA