Briois, V

Elen, K

Hardy, A

Longo, A

Marchal, Wouter

Mattelaer, Felix

Van Bael, MK

Van Hecke, Kristof

Ghent University Academic Bibliography

International Conference on Coordination Chemistry, 2018, Sendai, Japan  Unraveling the crucial role of Cu(I) intermediates in self-reducing MOD inks for flexible electronics W. Marchal,a A. Longo,b V. Briois,c K. Van Hecke,d F. Mattelaer,e K. Elen,a M.K. Van Bael,a A. Hardy a,*   a UHasselt - Hasselt University, Institute for Materials Research (IMO-IMOMEC), Inorganic and Physical chemistry, Agoralaan D, 3590 Diepenbeek, Belgium b ESRF – European Synchrotron Radiation Facility, Avenue des martyrs 71, 38043 Grenoble, Cedex 9, France c Synchrotron SOLEIL, L’orme des merisiers, Saint-Aubin, 91112 Gif-sur Yvette, France d Ghent University, Department of Inorganic and Physical Chemistry, Krijgslaan 281 S3, 9000 Gent, Belgium e Ghent University, Department of Solid State Sciences, Krijgslaan 281 S1, 9000 Gent, Belgium    *An.Hardy@uhasselt.be The integration of electronic components in flexible materials such as paper, textiles and plastics is identified as a key challenge for the development of future smart applications including sensors, wireless communication and wearables. In this perspective, the fast and scalable low-temperature deposition of nanoscale metallic features is of utmost importance. Recently, a new class of copper inks, consisting out of self-reducing amine-based formato complexes was developed.1,2 These novel inks yield metallic depositions with an outstanding electrical conductivity (± 10 μΩ cm) at temperatures of 150 °C or less, well below the reduction temperature of neat copper formate (around 225 °C). However, a fundamental explanation for this reaction mechanism and the corresponding temperature shift upon coordination is currently missing. In this work, a wide variety of self-reducing copper complex inks were synthesized and analyzed in detail using single-crystal XRD, EXAFS, FTIR and Raman spectroscopy. In addition, the reduction mechanism was monitored using in-situ XRD and XANES, in combination with cutting-edge statistical data treatment methods such as principal component analysis (PCA), revealing the crucial role of the Cu(I) intermediate and its complex structure.3 Eventually, recommendations for the design of effective inks can be formulated, contributing to a future of flexible printed electronics.    The authors would like to acknowledge the SIM - Met@link project for financial support.  1 A.Yabuki, S. Tanaka, Materials Research Bulletin, 2012, 47, 4107. 2 Y. Farraj, M. Grouchko, S. Magdassi, Chemical Communications, 2015, 51, 1578. 3 W.Marchal, PhD thesis, 2018. 

Unraveling the crucial role of Cu(I) intermediates in self-reducing MOD inks for flexible electronics

https://biblio.ugent.be/publication/8568281/file/8568282

Unraveling the crucial role of Cu(I) intermediates in self-reducing MOD inks for flexible electronics

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