Copper specimens were deformed by equal channel angular pressing (ECAP) up to 8 passes. The microstructure was studied by X-ray line profile analysis. The crystallite size is reduced to a few tens of nanometers even after the first ECAP pass and it does not change significantly during further deformation. At the same time, the dislocation density increases gradually up to 4 ECAP passes. The thermal stability of the microstructure is examined by differential scanning calorimetry (DSC). The temperature of the DSC peak decreases whereas the stored energy increases with increasing strain. At the beginning of the heat release a bimodal grain structure develops indicated by a special double-peak shape of the diffraction line profiles