Heterogeneous
Solution Deposition of High-Performance Adhesive Hybrid Films
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Abstract
Interfaces between organic and inorganic
materials are of critical importance to the lifetime of devices found
in microelectronic chips, organic electronics, photovoltaics, and
high-performance laminates. Hybrid organic/inorganic materials synthesized
through sol–gel processing are best suited to address these
challenges because of the intimate mixing of both components. We demonstrate
that deposition from <i>heterogeneous</i> sol–gel
solutions leads to the unique nanolength-scale control of the through-thickness
film composition and therefore the independent optimization of both
the bulk and interfacial film properties. Consequently, an outstanding
3-fold improvement in the adhesive/cohesive properties of these hybrid
films can be obtained from otherwise identical precursors