Copper/Parylene Core/Shell Nanowire Surface Fastener
Used for Room-Temperature Electrical Bonding
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Abstract
The traditional bonding technology
in electronic assembly relies
on high-temperature processes, such as reflow soldering or curing
of adhesives, which result in undesired thermal excursions and residual
stress at the bonding interface. Therefore, there is an urgent need
to attach electronic components on the circuit board with good mechanical
and electrical properties at room temperature. In this paper, a room-temperature
electrical surface fastener consisting of copper/parylene core/shell
nanowire (NW) arrays were prepared, and van der Waals (VDW) forces
were utilized to interconnect the core/shell NWs. Interestingly, the
Parylene C film becomes conductive due to dielectric breakdown when
the thickness of it is miniaturized to nanoscale. Our electrical surface
fastener exhibits high macroscopic adhesion strength (∼25 N/cm<sup>2</sup>) and low electrical resistance (∼4.22 × 10<sup>–2</sup> Ω·cm<sup>2</sup>). Meanwhile, a new theoretical
model based on VDW forces between the NWs is proposed to explain the
adhesion mechanism of the core/shell structure