Tuning
the Interfacial Thermal Conductance between Polystyrene and Sapphire
by Controlling the Interfacial Adhesion
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Abstract
In polymer-based electric microdevices,
thermal transport across polymer/ceramic interface is essential for
heat dissipation, which limits the improvement of the device performance
and lifetime. In this work, four sets of polystyrene (PS) thin films/sapphire
samples were prepared with different interface adhesion values, which
was achieved by changing the rotation speeds in the spin-coating process.
The interfacial thermal conductance (ITC) between the PS films and
the sapphire were measured by time domain thermoreflectance method,
and the interfacial adhesion between the PS films and the sapphire,
as measured by a scratch tester, was found to increase with the rotation
speed from 2000 to 8000 rpm. The ITC shows a similar dependence on
the rotation speed, increasing up to a 3-fold from 7.0 ± 1.4
to 21.0 ± 4.2 MW/(m<sup>2</sup> K). This study demonstrates the
role of spin-coating rotation speed in thermal transport across the
polymer/ceramic interfaces, evoking a much simpler mechanical method
for tuning this type of ITC. The findings of enhancement of the ITC
of polymer/ceramic interface can shed some light on the thermal management
and reliability of macro- and microelectronics, where polymeric and
hybrid organic–inorganic nano films are employed
