Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges

Abstract

Nowadays, micro- and nanochips are usually\ud fabricated with Silicon and/or glass. A simple, low-cost and\ud reliable integration packaging method that provides flexibility\ud to the incorporation of electronic and fluidic devices into a\ud system has not been fully developed yet. The use of Printed\ud Circuit Board material as substrate to create dry film resist\ud microfluidic channels is the core technology to provide such an\ud integration method. The feasibility and potential of the\ud proposed packaging method is demonstrated in this wor