Considerations on using SU-8 as a construction material for high aspect ratio structures

Abstract

This paper discusses two material aspects of SU-8 that have up till now been insufficiently documented. We present initial results on the outgassing behavior and a study on the dielectric properties of SU-8 at high bias voltage. The dielectric strength is determined to be at least 2 MV/cm. These elements are investigated in the light of plans to manufacture an SU-8 based Micro-Channel Plate (MCP). Although the outgassing properties and dielectric strength are favorable the patterning capabilities are expected to limit the use of such an MCP