As
the thickness becomes thinner, the importance of Coulomb scattering
in two-dimensional layered materials increases because of the close
proximity between channel and interfacial layer and the reduced screening
effects. The Coulomb scattering in the channel is usually obscured
mainly by the Schottky barrier at the contact in the noise measurements.
Here, we report low-temperature (<i>T</i>) noise measurements
to understand the Coulomb scattering mechanism in the MoS<sub>2</sub> channel in the presence of <i>h</i>-BN buffer layer on
the silicon dioxide (SiO<sub>2</sub>) insulating layer. One essential
measure in the noise analysis is the Coulomb scattering parameter
(α<sub>SC</sub>) which is different for channel materials and
electron excess doping concentrations. This was extracted exclusively
from a 4-probe method by eliminating the Schottky contact effect.
We found that the presence of <i>h</i>-BN on SiO<sub>2</sub> provides the suppression of α<sub>SC</sub> twice, the reduction
of interfacial traps density by 100 times, and the lowered Schottky
barrier noise by 50 times compared to those on SiO<sub>2</sub> at <i>T</i> = 25 K. These improvements enable us to successfully identify
the main noise source in the channel, which is the trapping–detrapping
process at gate dielectrics rather than the charged impurities localized
at the channel, as confirmed by fitting the noise features to the
carrier number and correlated mobility fluctuation model. Further,
the reduction in contact noise at low temperature in our system is
attributed to inhomogeneous distributed Schottky barrier height distribution
in the metal–MoS<sub>2</sub> contact region