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新型可控坍塌芯片连接技术(C4)及芯下材料力学性能研究进展
Authors
刘胜
汪海英
白以龙
赵亚溥
Publication date
1 January 2002
Publisher
Abstract
可控坍塌芯片连接 (C4)技术可以实现高速、高密度、小外形的封装 ,因此日渐得到关注和发展。然而 ,随着C4技术的普及 ,C4封装内由于芯片和基板间热膨胀系数 (CTE)的不匹配而引起的可靠性问题将日益突出 ,为此研究者在C4封装中引入芯下材料来提高C4封装的可靠性。文中侧重于制造工艺、可靠性以及最新进展对C4技术进行介绍 ,并且对C4技术中所用的芯下材料的力学性能及其对C4封装可靠性影响的研究现状进行评
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Institute Of Mechanics,Chinese Academy of Sciences
See this paper in CORE
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oai:dspace.imech.ac.cn:311007/...
Last time updated on 25/11/2020
Institute Of Mechanics,Chinese Academy of Sciences
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:dspace.imech.ac.cn:311007/...
Last time updated on 12/02/2018