Abstract

The effects of energy pulse packing on material transport during single-pulse laser processing of silicon is studied using temporarily shaped pulses with durations from 50 to 150 ns. Six regimes of material transport were identified and disambiguated through energy packing considerations over a range of pulse durations. Energy packing has been shown to shift the interaction to energetically costlier regimes without appreciable benefit in either depth, material removal or crater morphology and quality.The authors would like to thank the UK Technology Strategy Board under project TP14/HVM/6/I/BD5665. The authors acknowledge the EPSRC Centre for Doctoral Training in Photonic Systems Development for their generous support

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