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原位研究PCB-ENIG在吸附薄液膜下的大气腐蚀行为(英文)
Authors
丁康康
易盼
+4 more
李刚
李晓刚
肖葵
董超芳
Publication date
1 January 2016
Publisher
Abstract
通过阴极极化曲线、交流阻抗谱以及SEM、XPS,原位研究了相对湿度对无电镀镍金印制电路板(PCB-ENIG)在吸附薄液膜下的影响机制。结果表明:PCB-ENIG板在薄液膜下的阴极过程主要包括O_2、腐蚀产物和H_2O的还原过程。阴极电流密度随相对湿度的增加而增加,并且均小于溶液中阴极电流密度,表明扩散过程并不是阴极氧化还原过程的控制步骤。极化电位较负时,75%和85%相对湿度下的阴极极化电流密度逐渐减小。随着腐蚀产物的增加,试验后期腐蚀过程由阳极过程控制
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Last time updated on 22/01/2018