Over recent years, the miniaturization of R.F, and L.F. functions and the developments were running around the MCM technology.
This paper presents the work made, then the results, to get new MCM-C generic components for use as building blocks in future Ka-Band equipment.
The results show an actual reduction of weight and volume in comparison with the already advanced design made from separate micro-packages and a multi-layer polyimidc PCB for the low frequency part. This is achieved at equivalent electrical performances
